IEC IEC62374-1 Edition1.02010-09 BR INTERNATIONAL STANDARD NORME INTERNATIONALE colour nside Semiconductordevices Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers Dispositifsasemiconducteurs- Partie1:Essai de rupture dielectrique enfonction dutemps (TDDB)pour les couches intermetalliques IEC 62374-1:2010 material IEC IEC62374-1 I licensed to BR Demo by Thomson Reuters ( Edition 1.0 2010-09 INTERNATIONAL STANDARD NORME (Scientific). INTERNATIONALE Inc. colour inside subscr .techstreet.com. Semiconductordevices- Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers nloaded Dispositifsasemiconducteurs Partie 1:Essaide rupture dielectrique enfonction dutemps (TDDB)pour les couches intermetalliques No further INTERNATIONAL ELECTROTECHNICAL COMMISSION uctionor COMMISSION ELECTROTECHNIQUE INTERNATIONALE PRICECODE D CODEPRIX ICS 31.080 ISBN 978-2-88912-178-6 Uncontrolled when @ Registered trademark of the International Electrotechnical Commission Marque deposee de la Commission Electrotechnique Internationale material 62374-1@IEC:2010 2 CONTENTS FOREWORD. 1 Scope. RDemoby 2 Terms and definitions Test equipment. 3 4 Test samples. 4.1 General. 4.2 Test structure Procedures.. 5 5.1 General.. 5.2 Pre-test. 8 5.3 Test conditions Inc 5.3.1 General.. 5.3.2 Electric field 8 5.3.3 Temperature 5.4 Failure criterion Lifetime estimation 6 10 6.1 General 10 6.2 Accelerationmodel. 10 6.3 Formula of E model ..... 6.4 A procedure for lifetime estimation.. Lifetimedependence on inter-metal layerarea. 13 iloa 8 Summary. on Annex A(informative)Engineering supplementation for lifetime estimation. 14 Nol Bibliography. 16 28- -2014 Figure 1-Schematic image of test structure (comb and serpent pattern) James Figure2-Schematic image of teststructure (comb andcomb pattern) Madison Figure 3 - Cross-sectional image of test structure for line to stacked line including via ... Figure 4-Cross-sectional image of test structure for stacked line to stacked line including via ...... 8 No further Figure5-Test flowdiagram of constant voltagestress method .9 Figure 6 -Weibull distribution plot.. 11 Figure 7-Procedure to estimate the acceleration factor due to the electric field dependence.... 12 Figure 8 - Procedure to estimate the activation energy using an Arrhenius plot.... ted ncontrol led when